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How to improve the adhesion and processability of conductive silicone?

Publish Time: 2025-02-07
As a material with both conductivity and silicone properties, conductive silicone has a wide range of applications in electronics, medical, aerospace and other fields. However, its adhesion and processability are often the key factors that restrict its performance. In order to improve the adhesion and processability of conductive silicone, we can start from the following aspects.

First, in order to improve the adhesion, we can consider modifying the surface of conductive silicone. By introducing specific functional groups or additives, the polarity and chemical properties of the silicone surface are changed, thereby enhancing the interaction between it and the adherend. For example, a silane coupling agent can be added, one end of which can react chemically with the silicone molecular chain, and the other end can combine with the functional group on the surface of the adherend to form a strong chemical bond, thereby significantly improving the adhesion.

Secondly, optimizing the formula of conductive silicone is also an effective way to improve adhesion. By adjusting the type, content and distribution of conductive fillers (such as carbon black, metal powder, etc.), as well as the crosslinking density and molecular weight of the silicone matrix and other parameters, the viscosity and fluidity of conductive silicone can be regulated, thereby improving its adhesion performance. At the same time, choosing the appropriate vulcanization system and vulcanization conditions can also help improve the adhesion strength and aging resistance of conductive silicone.

In terms of processability, the fluidity, plasticity and molding process selection of conductive silicone have an important influence on its processability. In order to improve the processability of conductive silicone, the following measures can be taken: first, optimize the formula design, reduce the viscosity of silicone and improve its fluidity; second, adopt advanced molding processes, such as injection molding and extrusion molding, to meet the needs of products of different shapes and sizes; third, strengthen the temperature and time control during the production process to ensure that conductive silicone can be fully cross-linked during the vulcanization process to form a stable network structure.

In addition, the use of auxiliary materials or tools can also be considered to improve the processability of conductive silicone. For example, adding an appropriate amount of lubricant or release agent to silicone can reduce its friction resistance in the mold and improve the demolding efficiency; using professional silicone processing equipment and molds can also significantly improve the processing accuracy and yield of conductive silicone.

In summary, improving the adhesion and processability of conductive silicone requires multiple aspects, including surface modification, formula optimization, molding process selection and the use of auxiliary materials. By combining these measures, the performance and application scope of conductive silicone can be significantly improved.
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